DMS application in hot and cold bonding processes

A strain gauge (SG) measures deformations such as elongation and compression: when subjected to mechanical stress, its electrical resistance changes measurably, from which the mechanical stress in the component can be determined. To do this, a thin wire or film is applied to the component using a special adhesive – if the component deforms, the strain gauge deforms with it, thereby changing its resistance.

Depending on the requirements, we apply strain gauges using either a cold or hot bonding process: the cold bonding process is particularly suitable for flexible on-site use without the need for additional heat. The hot-bonding process, with a defined curing temperature, produces a particularly durable, long-term stable bond – ideal for demanding industrial measurement tasks.

In addition to applying strain gauges to our own force sensors, we also undertake the bonding and wiring of strain gauges onto your components – either in our laboratory or directly at your site.